Volume & Issue no: Volume 3, Issue 10, October 2014
_____________________________________________________________________________
Title: |
ULTRAPRECISION HIGH RATE ANODIC DISSOLUTION PROCESSES IN ECM |
Author Name: |
Anil Chourasia, Sumit Kumar Singh, Dr. Pankaj Agrawal |
Abstract: |
ABSTRACT
As electronic packages become smaller in size, the pitch of metal line is getting shorter. Decrease of line pitch in electronic
packages and substrate of electronic component causes the electrochemical migration (ECM) more frequently. If the electronic
components are exposed to high temperature and high humidity environments with authorized voltage condition, the metals in
packages and substrate are easily ionized and form conductive dendrites, leading to insulation failure. ECM process consists of
three steps: anodic dissolution, ion migration, and dendritic growth. Under low concentration of passivating electrolyte, low
machining voltage and high-frequency short-pulse current, the machining gap can be reduced to about 10 mum. A deep microhole
about 100 mum in diameter was drilled by edge-cut electrode on stainless steel with 750 mum thickness. The process of
NC micro-EC milling is proposed, and microstructures with high-aspect ratio on stainless steel were fabricated by micro-EC
milling, such as profiled micro-hole, micro spiral beam and micro array square columns |
Cite this article: |
Anil Chourasia, Sumit Kumar Singh, Dr. Pankaj Agrawal , "
ULTRAPRECISION HIGH RATE ANODIC DISSOLUTION PROCESSES IN ECM" , International Journal of Application or Innovation in Engineering & Management (IJAIEM) ,
Volume 3, Issue 10, October 2014 , pp.
347-354 , ISSN 2319 - 4847.
|
Full Text [PDF] Back to Current Issue  |
|
